Thermal Analysis Skill Electronic system thermal modeling and analysis for reliable component operation. Purpose This skill provides comprehensive capabilities for thermal analysis of electronic systems, from component-level junction temperature calculations to system-level thermal management design. It supports heat sink selection, thermal interface material evaluation, and safe operating area verification. Capabilities Junction-to-Ambient Thermal Resistance - Thermal resistance network modeling - Junction-to-case (theta jc) calculations - Case-to-sink (theta cs) with TIM analysis - Sink-to-…